Global Nanoelectromechanical System (NEMS) Market is expected to reach $108.88 Million by 2022

Nanoelectromechanical systems or NEMS are tiny machines/devices integrating electrical and mechanical functionality on the nanometer scale. Examples of NEMS may include tiny accelerometers, chemical detectors, tiny cantilever which is a tiny electrical circuit which is used to measure the deflection of the lever. NEMS are logically the successors of MEMS (microelectricalmechanical systems). NEMS integrate transistor-like nanoelectronics with mechanical actuators, pumps, or motors, and may thereby form physical, biological, and chemical sensors. Important advantages of NEMS are low mass, high mechanical resonance frequencies, potentially large quantum mechanical effects such as zero point motion, and a high surface-to-volume ratio useful for surface-based sensing mechanisms. In NEMS the mechanical properties of the carbon nanotubes & graphene are integrated to get the robustness of carbon-based NEMS.

                                    Source: http://www.northeastern.edu/nemslab/

According to a new market research report by MarketsandMarkets, the global NEMS market is expected to reach $108.88 million by 2022, at an estimated CAGR of 29.69% from 2012 to 2022. The report describes the global NEMS market on the basis of applications, products, components, materials and geography. The applications includes STM/AFM, medical, gas/flow sensor, RF functionalities. The NEMS products described in the report are switches and cantilevers. The materials used in the NEMS products are Graphene, ZnO, SiC, GaN, SiO2. The components that are integrated to form NEMS products are nanotubes, nanowires, and nanofilms. Furthermore, the market is forecasted using both bottoms-up and top-down approaches.

ADVANTAGES OF NEMS:

1.       High resonating frequency.

2.       Low energy consumption.

3.       Size reduction

4.       Multiple frequencies on a single chip.

5.       Cost reduction by IC reduction.

NEMS extends the concept of miniaturization towards the level of atoms and molecules; hence NEMS have their core movement at the nanometer level at or below 100nm. It is expected that in the future NEMS will be preferred over MEMS for the high frequency applications like high frequency resonator and ultrasensitive sensors. This is because NEMS have smaller mass, higher electrical efficiency, high resonating frequency (which is in the range of GHz) and higher surface area to volume ratio. In the NEMS, the mechanical components are combined with electronic properties at nanoscale to develop devices which are capable of performing unconventional tasks. NEMS have been witnessed as a fundamental breakthrough in designing and manufacturing industry as tiny mechanical devices are combined with the electronic circuitry using various nano fabrication techniques.

The market research report on NEMS global market describes the market trends, drivers, and challenges of NEMS market and forecasts the NEMS market from 2012 to 2022, based on the various NEMS applications. The report can be referred here:
http://www.sbwire.com/press-releases/nanoelectromechanical-system-nems-market-to-reach-10888-million-by-2022-271626.htm

Global 3D IC and TSV Interconnect Market is expected to reach $6.55 billion by 2016

INTRODUCTION:

3D IC or 3-Dimensional Integrated Circuit is a term in electronics used for a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms; thus the full definition is still somewhat fluid. In a 3D IC package two or more chips (ICs) are stacked vertically so that they occupy less space and/or have greater connectivity. There are 4 manufacturing technologies for 3D IC namely, Monolithic, Wafer-on-Wafer, Die-on-Wafer, and Die-on-Die method.

CURRENT SCENARIO OF 3D IC MARKET:

The significant growth of the 3D IC market is attributed to accelerated demand for higher bandwidths, reduced power consumption, and higher density. High efficiency of the solution and the guaranteed return on investment (ROI) has made 3D IC technology plus its integration with through silicon vias (TSVs) significant commercial strides in the past 2 years. There are some challenges too as this technology is new it is poised to face some new challenges like Design complexity, TSV-introduced overhead, Testing, Lack of standards, Heterogeneous integration supply chain, and Lack of clearly defined ownership. Memories and sensors are expected to provide the largest market owing to improvements in design that can be achieved in 3D ICs.

BENEFITS OF 3D ICs:

Footprint - More functionality in a smaller space. Moore’s Law is extended.

Cost effective.

Increased Bandwidth – The stack up arrangement allows a bus much wider than the typical 128 or 256 bits alleviating the memory wall problem.

Heterogeneous integration – The concept of putting different functionality in different layers provides heterogeneous integration of different processes.

Shorter interconnect - Average wire length is reduced.

Power – Reduced power consumption by 15-100 times. Less parasitic capacitance, less heat generation, extended battery life, and lower cost of operation.

Design - Higher order of connectivity and vertical design offers new design possibilities.

Circuit security – Reverse engineering of the circuitry is quite complicated hence providing a certain level of security.

FUTURE PROSPECTS OF 3D IC MARKET:

According to new market research report by MarketsandMarkets, the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016. Asia is leading the 3D IC market and has the highest growth rate. This is mainly because a huge number of semiconductor companies such as Samsung (South Korea), United Microelectronics Corporation (Taiwan), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), and more boosting the 3D IC manufacturing in a cost effective manner. In terms of revenue generation too, Asia holds the highest share of around 40%, followed by North America with 35%. In the near future, it is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects. This new 3D IC/Chip Market and TSV Interconnect Market research report categorizes the 3D IC market on the basis of manufacturing approaches, usage in different end-products, applications and geographical analysis; forecasting revenue and analyzing trends.

The report can be referred here:
http://www.sbwire.com/press-releases/3d-ic-and-tsv-interconnect-market-worth-655-billion-by-2016-at-a-cagr-of-169-382301.htm

Wireless Audio Device Market is expected to reach $13.75 Billion by 2018

Introduction: Wireless computer accessories are becoming quite popular among youth. Be input devices like mouse, keyboard, pointer or multimedia accessories like projectors and wireless audio devices. Computers are not a stationary household workplace anymore. People prefer to use their PCs simultaneously, in different places and different purposes all without wires. Obviously the wireless streaming of audio and video is the next step through a home wi-fi network. The technology behind any wireless audio device is the same wireless technology in general – a transmitter is connected to a source device (e.g. a computer, tablet, or DVD player) from which information is sent to a receiver on a second device (e.g. an external stereo system, home theatre, or a car stereo).

Current Scenario in Wireless Audio Device Industry: Wireless audio device industry is one of the booming industries in the electronics market. The wireless connectivity to stream and play music is the essence of the wireless audio device industry. Because of the low power consumption, relatively cheap rates & freedom of movement, the demand for such devices is increasing in the domestic as well as commercial sector such as the defense and automotive sector.  The wireless audio device market consists of wireless speakers, sound bars, headphones, and microphones and the various technologies exploited to achieve wireless connectivity are Bluetooth, Airplay, IR & RF, and SkAA.

                                         Source: http://www.audiopro.com/

Wireless Audio Devices Benefits:

1.       No burden of physical wires.

2.       Listening to music at different places.

3.       Available space by doing away with CDs/DVDs.

4.       Avoiding household friction.

5.       Portability and mobility.

Future trends in Wireless Audio Device Industry: According to a new market research report by MarketsandMarkets, the total market is expected to generate revenues of $13.75 billion by 2018, growing at an estimated CAGR of 24.02% from 2013-2018. Tremendous advancement is expected in the use of wireless audio devices in future because of the customers’ ever increasing expectations for high quality sound and unrestricted mobility of audio devices. This report by MarketsandMarkets, describes the market trends, drivers, restraints and opportunities of the wireless audio device market and forecasts the market to 2018, based on product, application, and geography. Bose Corporation (U.S.), Harman International Industries (U.S.), Sennheiser Electronic Gmbh (Germany), Sony Corporation (Japan), Philips (The Netherlands), Voxx International (U.S.), Shure, Inc. (U.S.) Vizio, Inc. (U.S.), Plantronics, Inc. (U.S.) and Polk Audio (U.S.) are some of the key players in the wireless audio device market.

Conclusion: Thrive for electronic devices, which are independent of wires is increasing and wireless audio devices are becoming a rage among people. More and more people are realizing the benefits of the wireless audio devices and opting for setting up a system that can transmit audio wirelessly. There are also various firms that specialize in providing sophisticated integrated wireless audio device systems. Otherwise, simple wireless devices are widely available in the market as well as on the online marketplaces such as eBay, Flipkart etc.

Micro Servers Market is expected to worth $26.55 Billion by 2018

If simply put, micro servers can be referred to servers that multiple mobile processor chips, that use low power and require less space. The micro servers are specifically used by small to medium sized businesses. Micro servers are small server appliances that work like servers as off-the-shelf appliances that are designed for ease of installation and maintenance. A micro server consists of an operating system, required hardware and required software preinstalled & configured by the manufactured itself with some configurations left to be performed by the end-user through a touch panel or a Web browser. Major applications of micro servers are media storage, internet data storage (like lightweight web serving), low end dedicated hosting and simple content delivery. Micro servers are used by corporations with minimal IT staff. Micro servers are emerging as a popular choice for small to medium sized businesses as these do not need a full-scale rack or tower server.

According to a new market research report by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018. It is considered that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in next five years it is expected to reach 25 to 30% per cent of the global server market.

                                          Source: http://www.brightsideofnews.com/

Important things about micro servers:

1.       More efficient for small jobs.

2.       There’s a place for smaller cores.

3.       Low power consumption which means lower running costs.

4.       These are space savers.

5.       Unlimited applications for small businesses.

6.       Shaking up the server market.

7.       Micro servers will become even more specialized.

Among various applications of micro server, media storage covers the largest of the micro server market though it is forecast-ed that data centers application will surpass it by 2018. The reason is growing online business and increasing requirement of security, storage, resilience in corporate. Cloud computing which is another application of micro servers will grow at a phenomenal CAGR of 62.3% from 2013 to 2018.

As far as geography is concerned, North America has the largest market for these servers. Media storage and data centers application are growing an extraordinary rate in these regions and their growth will supplement the growth of micro servers. The prime reason behind this is the emergence of China and Japan in the micro server market. As the internet datacenters market is growing, there is a huge need of setting up infrastructure to meet this demand. The report covers recent developments in the industry like AMD (U.S.) acquiring SeaMicro (U.S.) in march 2012 and partnership between Calxeda (U.S.) and Penguin computing (U.S.) in October 2012 to develop low power ARM micro servers. Several other acquisitions, mergers, new product launch, agreements etc. have taken place recently and are discussed in the report. The major players in the industry are Intel Corporation (U.S.), Hewlett-Packard (U.S.), Dell Inc (U.S.), Fujitsu (Japan), Samsung Electronics (South Korea) and others.

The report can be referred here:

http://www.marketsandmarkets.com/Market-Reports/micro-servers-market-952.html